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Quik-Pak

Providing microelectronic packaging, assembly, and wafer-processing solutions for semiconductor and electronics industries.

Based in

United States

🇺🇸
MOQ: 1000+Avg production time: 120+ daysAvg. response time: 1 dayCountry: United States
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Quik-Pak

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Quik-Pak is known for

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  • Contract Manufacturer
  • Vetted Pietra Supplier

Quik-Pak can make

  • Open Cavity Plastic Packages
  • Wafer Backgrinding
  • Wafer Dicing
  • Die Sort
  • Die Attach
  • Gold Ball Wire Bonding
  • Encapsulation
  • Flattening
  • Remolding
  • Marking
  • Branding
  • Custom Assembly
  • Flip Chip Bonding
  • Ceramic Packages
  • Chip-on-Board
  • Stacked Die
  • MEMS
  • Substrate Design
  • Fabrication
  • Over-Molded QFNs
  • Pre-Molded Air Cavity QFNs
  • Components
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